I decided to install a copper plate between the processor and the phone frame, putting it on the thermal paste on both sides. The yellow thermal-conductive rubber band is glued to the phone's frame, it is in the recess, and it seems to me that it sits deeper than the plane of the frame. Inside the screen are glued two heat-conducting rubber bands for memory and a power controller, and also glued something similar to an adhesive tape over the processor. The screen itself already has a cutout above the processor. It closes this cloth, similar to metal. With a stationery knife, cut out a cloth on the screen according to the size of the square hole. Now we need to peel off the yellow box, we do not need it anymore. Unfasten the box and clean it off. I used isopropyl alcohol and a napkin. It's time to try on a copper plate. Took a thickness of 0.8 millimeters. I layed the board down to try it on and it seems ideal. Take the thermal paste, squeeze out a little and evenly spread a thin layer of copper plate. Having smeared, stick it on the frame. Add the thermal paste on the chip, a little bit of thermal paste on the memory and the power controller just to be safe. It wont break it. Smear the thermal paste with a thin layer on the chip. We also smear thermal grease on the rubber bands of the screen. Put the board in place, neatly on the frame, and make sure it's flat in all places. A little press and checked board so that the thermal paste is evenly distributed. I cant show the performance before this mod, but during the GFX benchmark test, Long Term Performance, heats the processor to 41 degrees in just seven minutes. The test on video is accelerated seven times. On subjective grounds, under load, the screen immediately warmed up, which indicates good heat transfer. Judging by the sensor, the temperature began to increase more slowly, and also to cool down more slowly, which indirectly confirms that our method is at least a bit, but will add health to the processor. Of course, this is not an absolute guarantee from the boot-magnifier, but nevertheless we have eliminated sharp temperature jumps, extreme heating of the processor, and also the plate slightly presses the processor itself to the board. I hope at least a little, but it will help to postpone the Boot-Loop. Nexus lives on! I hope my video was useful. Thank you all for your attention.
