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In short, AMD saves a lot on die costs by forgoing AI and ray tracing fixed function accelerators and moving to smaller dies with advanced packaging. The advanced packaging cost is up significantly with AMD’s RDNA 3 N31 and N32 GPUs, but the small fan-out RDL packages are still very cheap relative to wafer and yield costs. Ultimately, AMD’s increased packaging costs are dwarfed by the savings they get from disaggregating memory controllers/infinity cache, utilizing cheaper N6 instead of N5, and higher yields. Memory BOM utilizes the full memory bus width using single-sided 16Gb G6 or 16Gb G6x memory.
Pa zar Zen4 ne izlazi prekosutra?Prodaja verovatno u isto vreme kao Zen4.
AMD je nudio nize cene ranijih generacija pa su ljudi opet kupovali nV. Ni meni se ne svidja, ali ako cekamo na AMD da regulise cene nV kartica pa da onda kupimo nV onda nije ni cudo sto ce verovatno staviti cene vrlo bliske nV...Baš me zabole za njihov profit, hoću niže cene.
Lose sam se izrazio, zeznuli su se sto su uopste ostavili TSMC za proslu generaciju, sad im papreno naplacuju wafere a tu cenu oni nama prosledjuju...NV ne bi mogla da izvede to sa 4000 da su ostali na Samsungu...
Pitanje je koliko su imali izbora uopste - ako se dobro secam, vecina wafera je bila alocirana Apple-u, u tom slucaju cak je i NV tu musterija drugog ranga. Da su jurili TSMC mozda bi bilo jos manje kartica nego sto je bio slucaj.Lose sam se izrazio, zeznuli su se sto su uopste ostavili TSMC za proslu generaciju, sad im papreno naplacuju wafere a tu cenu oni nama prosledjuju...
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